Reflow soldering processes and Troubleshooting

SubTitle

SMT, BGA, CSP and flip chip technologies

Author Statement

Ning-Cheng Lee

Publication

Newnes

Publication Year

c2002

Collation

ix, 270 p. ill.

Notes

Includes bibliographical references and index

Subject

Electronic apparatus and appliances --Design and construction , Solder and soldering , Electronic packaging , Electric connectors

Main class

621.

Sub class

381046

Cutter no

L5101r

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