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RecordNumber
4247
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Author
Lee, Ning-Cheng
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Title
Reflow soldering processes and Troubleshooting
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SubTitle
SMT, BGA, CSP and flip chip technologies
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Author Statement
Ning-Cheng Lee
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Publication
Newnes
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Publication Year
c2002
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Collation
ix, 270 p. ill.
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Notes
Includes bibliographical references and index
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Subject
Electronic apparatus and appliances --Design and construction , Solder and soldering , Electronic packaging , Electric connectors
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Main class
621.
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Sub class
381046
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Cutter no
L5101r
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Link To Document :
