Microvias for low-cost, high-density interconnects

SubTitle

for low-cost, high-density interconnects

Author Statement

John H. Lau, S.W. Ricky Lee.

Publication

McGraw-Hill

Publication Year

c2001

Collation

xxiii, 565 p. ill.

Subject

Microelectronic packaging. , Integrated circuits , Semiconductors , Printed circuits.

ADDED ENTRIES

Lee, S. W. Ricky.

Main class

621

Sub class

.381046

Cutter no

L36m

ISBN

071363270

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