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RecordNumber
2388
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Author
Lau, John H
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Title
Microvias for low-cost, high-density interconnects
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SubTitle
for low-cost, high-density interconnects
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Author Statement
John H. Lau, S.W. Ricky Lee.
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Publication
McGraw-Hill
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Publication Year
c2001
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Collation
xxiii, 565 p. ill.
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Subject
Microelectronic packaging. , Integrated circuits , Semiconductors , Printed circuits.
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ADDED ENTRIES
Lee, S. W. Ricky.
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Main class
621
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Sub class
.381046
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Cutter no
L36m
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ISBN
071363270
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Link To Document :
